The deal will see Cannon become the EMEA partner for Asis, providing direct sales, engineering sales support, and first tier after sales support through the company’s UK headquarters.
Asis, part of the Trans Innovation Group, produces a range of 19 inch rack mountable ATCA chassis available in a variety of sizes from one to 14 slots that were originally designed for the telecommunications market and are now used in a variety of markets, such as defence, medical, enterprise and cloud computing. The firm’s headquarters house more than 30 research and development engineers, including mechanical engineers with experience in thermal and fluid dynamics, PCB designers, systems engineers, and a software department.
‘The chief focus for the partnership will be to develop new relationships with OEM, TEM, and chassis system integrators within the communications, test and measurement, security and defence, medical, and scientific markets,’ explains Glenn Conlon, director of business development, Cannon Electronic Packaging.
The agreement will see Asis, previously successfully focussed on the U.S. and China, teaming up with Cannon to take on the European, Middle East, and African markets. Cannon is to help drive further sales growth throughout the EMEA region as well as play a vital part in facilitating support for a global customer base.
‘We are delighted with being instrumental in Asis’s expansion plans into the EMEA region,’ said Cannon Technologies’ managing director, Matthew Goulding. ‘I’m excited to see our new director of business development Glenn Conlon, leading this new partnership. He was the key to bringing our two companies together thanks to his experience, knowledge, and previous success within the ATCA and MicroTCA markets.’
Shai Benchmuel, sales director at Asis, commented, ‘Asis was actively involved in the formation of the ATCA standard since its inception in 2001 and was chosen by Intel to codevelop the market’s first ATCA chassis.
‘Our goal is to lead the ATCA market by leveraging our expertise in high speed interconnect and thermal modelling to develop ATCA products that exceed the standard in performance and market requirements.’